Patent Assignment
Reel/Frame 026669/0518
Assignment of Assignor's Interest
Recorded: 2011-07-26
Pages: 3
Assignors
NORITAKE, CHIKAGE
Executed: 2011-07-04
ARAI, HIROAKI
Executed: 2011-07-04
YAMAUCHI, YOSHIYUKI
Executed: 2011-07-05
YAMAZAKI, YASUOU
Executed: 2011-07-05
SUGIMOTO, NAOKI
Executed: 2011-07-05
SAKAI, YASUYUKI
Executed: 2011-07-05
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Module with Cooling Mechanism and Production Method Thereof
Application:
13/167,144 →
Publication:
US 2011/0316143