Patent Assignment
Reel/Frame 026693/0932
Assignment of Assignor's Interest
Recorded: 2011-08-03
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Thermally Enhanced Semiconductor Assembly with Bump/Base/Flange Heat Spreader and Build-Up Circuitry
Application:
13/197,163 →
Publication:
US 2012/0126399