Patent Assignment
Reel/Frame 026720/0297
Assignment of Assignor's Interest
Recorded: 2011-08-09
Pages: 7
Assignors
XUE, YAN XUN
Executed: 2011-07-25
HUANG, PING
Executed: 2011-07-27
HO, YUEH-SE
Executed: 2011-07-26
YILMAZ, HAMZA
Executed: 2011-07-26
LU, JUN
Executed: 2011-07-26
LU, MING-CHEN
Executed: 2011-07-27
Assignee
ALPHA AND OMEGA SEMICONDUCTOR, INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Wafer Level Package Structure and the Fabrication Method Thereof