Patent Assignment
Reel/Frame 026721/0823
Assignment of Assignor's Interest
Recorded: 2011-08-09
Pages: 3
Assignors
THACKER, HIREN D.
Executed: 2011-04-18
CUNNINGHAM, JOHN E.
Executed: 2011-04-18
SHUBIN, IVAN
Executed: 2011-04-18
KRISHNAMOORTHY, ASHOK V.
Executed: 2011-04-18
Assignee
ORACLE INTERNATIONAL CORPORATION
500 ORACLE PARKWAY, MAIL STOP 5OP7, REDWOOD CITY, CALIFORNIA, 94065
Covered Property
(1)
Interconnection and Assembly of Three-Dimensional Chip Packages