IP Library Assignment 026731/0252
Patent Assignment
Reel/Frame 026731/0252

Assignment of Assignor's Interest

Recorded: 2011-08-10 Pages: 26
Assignors
RAJAGOPALAN, NAGARAJAN
Executed: 2011-02-15
PARK, JI AE
Executed: 2011-02-15
YAMASE, RYAN
Executed: 2011-03-04
PATEL, SHAMIK
Executed: 2011-02-23
NOWAK, THOMAS
Executed: 2011-02-15
XIA, LI-QUN
Executed: 2011-03-02
KIM, BOK HOEN
Executed: 2011-02-22
DING, RAN
Executed: 2011-02-22
BALDINO, JIM
Executed: 2011-04-05
NAIK, MEHUL
Executed: 2011-03-04
RAMASWAMI, SESH
Executed: 2011-02-24
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Fabrication of Through-Silicon Vias on Silicon Wafers
Patent: 8,283,237 →
Application: 12/978,129 →
Publication: US 2012/0164827