Patent Assignment
Reel/Frame 026734/0372
Assignment of Assignor's Interest
Recorded: 2011-08-11
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2011-08-02
YANG, CHUNG-YING
Executed: 2011-08-02
CHEN, YING-JU
Executed: 2011-08-02
LIANG, SHIH-WEI
Executed: 2011-08-02
YANG, CHING-JUNG
Executed: 2011-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Probe Pad on a Corner Stress Relief Region in a Semiconductor Chip