Patent Assignment
Reel/Frame 026735/0417
Assignment of Assignor's Interest
Recorded: 2011-08-10
Pages: 2
Assignors
SASAKI, YOSHITAKA
Executed: 2011-07-15
ITO, HIROYUKI
Executed: 2011-07-15
IKEJIMA, HIROSHI
Executed: 2011-07-20
IIJIMA, ATSUSHI
Executed: 2011-07-20
Assignees
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DR., MILPITAS, CALIFORNIA, 95035
SAE MAGNETICS (H.K.) LTD.
6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SAE TECHNOLOGY CENTRE, SHATIN, N.T., HONG KONG, CHINA
Covered Property
(1)
Layered Chip Package and Method of Manufacturing Same