Patent Assignment
Reel/Frame 026772/0487
Assignment of Assignor's Interest
Recorded: 2011-08-18
Pages: 2
Assignors
CHEN, YING-JU
Executed: 2011-08-11
CHEN, HSIEN-WEI
Executed: 2011-08-11
YU, TSUNG-YUAN
Executed: 2011-08-11
LIANG, SHIH-WEI
Executed: 2011-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bond Pad Structure to Reduce Bond Pad Corrosion