Patent Assignment
Reel/Frame 026793/0643
Assignment of Assignor's Interest
Recorded: 2011-08-23
Pages: 3
Assignors
TZENG, KUO-CHYUAN
Executed: 2011-08-12
TRAN, LUAN C.
Executed: 2011-08-16
WANG, CHEN-JONG
Executed: 2011-08-12
TU, KUO-CHI
Executed: 2011-08-12
LEE, HSIANG-FAN
Executed: 2011-08-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Fabricating Metal-Insulator-Metal (Mim) Capacitor Within Topmost Thick Inter-Metal Dielectric Layers