Assignment of Assignor's Interest

Recorded: 2011-09-01 Pages: 3

Assignor

SMITH, NED M.

Executed: 2007-08-21

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052

Covered Properties (2)

Method and Apparatus for Virtualization of a Multi-Context Hardware Trusted Platform Module (Tpm)

Patent: 8,032,741 →

Application: 11/894,915 →

Publication: US 2009/0055641

Method and Apparatus for Virtualization of a Multi-Context Hardware Trusted Platform Module (Tpm)

Patent: 8,261,054 →

Application: 13/222,382 →

Publication: US 2011/0314472