Patent Assignment
Reel/Frame 026885/0527
Assignment of Assignor's Interest
Recorded: 2011-09-12
Pages: 2
Assignors
NG, KEAT CHUAN
Executed: 2011-09-05
CHAN, BIT TIE
Executed: 2011-09-05
TAN, KHENG LENG
Executed: 2011-09-05
Assignee
AVAGO TECHNOLOGIES (ECBU) IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, YISHUN, 768923, SINGAPORE
Covered Property
(1)
High Thermal Conductivity and Low Degradation Die Attach with Dual Adhesive
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 7, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0496 →
Patent Security Agreement
May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032851-0001)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
Patent Security Agreement
Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Merger
Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →