IP Library Assignment 026897/0828
Patent Assignment
Reel/Frame 026897/0828

Assignment of Assignor's Interest

Recorded: 2011-09-13 Pages: 6
Assignors
FEGER, CLAUDIUS
Executed: 2011-09-12
GAYNES, MICHAEL A.
Executed: 2011-08-23
NAH, JAE-WOONG
Executed: 2011-08-22
SHIH, DA_YUAN
Executed: 2011-08-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
No Flow Underfill or Wafer Level Underfill and Solder Columns
Patent: 8,963,340 →
Application: 13/231,594 →
Publication: US 2013/0062757
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Data of the Fourth Inventor Previously Recorded on Reel 026897 Frame 0828. Assignor(S) Hereby Confirms the Assignment. Dec 11, 2018
From: FEGER, CLAUDIUS; GAYNES, MICHAEL A.; NAH, JAE-WOONG; SHIH, DA-YUAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 047777/0238 →