Patent Assignment
Reel/Frame 026914/0003
Assignment of Assignor's Interest
Recorded: 2011-09-15
Pages: 3
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTRY, 32062, TAIWAN
Covered Property
(1)
Package Structure for Chip and Method for Forming the Same