Patent Assignment
Reel/Frame 026934/0406
Assignment of Assignor's Interest
Recorded: 2011-09-20
Pages: 4
Assignors
JOYNER, BURTON L, II
Executed: 2011-09-16
SULLIVAN, CARL E
Executed: 2011-09-16
ANDERSON, FRANK E
Executed: 2011-09-20
STRUNK, TIMOTHY L
Executed: 2011-09-16
Assignee
LEXMARK INTERNATIONAL, INC.
740 WEST NEW CIRCLE ROAD, BUILDING 82-1 LEGAL, LEXINGTON, KENTUCKY, 40550
Covered Property
(1)
Heater Chips with Silicon Die Bonded on Silicon Substrate, Including Offset Wire Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.