Patent Assignment
Reel/Frame 026957/0163
Assignment of Assignor's Interest
Recorded: 2011-09-23
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Having Electrical Connections or Varying Heights Between Substrates,and Semiconductor Device Including the Stacked Semiconductor Pacakge