Patent Assignment
Reel/Frame 026977/0286
Assignment of Assignor's Interest
Recorded: 2011-09-27
Pages: 2
Assignors
WANG, CHUNG-YU
Executed: 2011-07-20
WU, CHIH-WEI
Executed: 2011-07-20
LU, SZU WEI
Executed: 2011-07-20
LIN, JING-CHENG
Executed: 2011-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Apparatus and Methods for Molding Die on Wafer Interposers