Patent Assignment
Reel/Frame 026983/0181
Assignment of Assignor's Interest
Recorded: 2011-09-28
Pages: 8
Assignors
BORAAS, MICHAEL A.
Executed: 2011-09-21
KAMATH, VINOD
Executed: 2011-09-28
MILLER, MICHAEL S.
Executed: 2011-09-21
STEINKE, MARK E.
Executed: 2011-09-21
WAKIL, JAMIL A.
Executed: 2011-09-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method Of Forming An Overmolded Dual In-Line Memory Module Cooling Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
Assignment of Assignor's Interest
Nov 12, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037101/0969 →
Corrective Assignment to Correct the Assignment Document Containing Typo Errors Previously Recorded at Reel: 037101 Frame: 0969. Assignor(S) Hereby Confirms the Assignment.
Dec 28, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037689/0190 →
Assignment of Assignor's Interest
Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050300/0570 →