Patent Assignment
Reel/Frame 027029/0854
Assignment of Assignor's Interest
Recorded: 2011-10-07
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Stackable Semiconductor Assembly with Bump/Base/Flange Heat Spreader and Electromagnetic Shielding
Application:
13/267,946 →
Publication:
US 2012/0126401