IP Library › Assignment 027082/0065
Patent Assignment
Reel/Frame 027082/0065

Assignment of Assignor's Interest

Recorded: 2011-10-18 Pages: 3
Assignor
SEAH, LEE HUA ALVIN
Executed: 2011-10-18
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Dual Interlock Heatsink Assembly for Enhanced Cavity Pbga Packages, and Method of Manufacture
Patent: 8,736,046 →
Application: 13/276,181 →
Publication: US 2013/0093085
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →