IP Library › Assignment 027089/0651
Patent Assignment
Reel/Frame 027089/0651

Merger

Recorded: 2011-10-19 Pages: 6
Assignor
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Package Substrate Embedded with Semiconductor Component
Patent: 8,058,718 →
Application: 12/340,405 →
Publication: US 2009/0166841
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 13, 2009
From: HSU, SHIH-PING; CHIA, KAN-JUNG
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 022103/0325 →