Patent Assignment
Reel/Frame 027100/0620
Assignment of Assignor's Interest
Recorded: 2011-10-21
Received: 2011-10-21
Pages: 3
Assignor
CHOI, DAESIK
Executed: 2011-09-23
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with External Wire Connection and Method of Manufacture Thereof
Application:
13/244,262 →