Patent Assignment
Reel/Frame 027120/0170
Assignment of Assignor's Interest
Recorded: 2011-10-24
Pages: 2
Assignors
MURASUGI, NARUTOSHI
Executed: 2011-10-04
MAEKAWA, KAZUNORI
Executed: 2011-10-04
ISHIJIMA, ZENZO
Executed: 2011-10-04
Assignee
HITACHI POWDERED METALS CO., LTD.,
2-1, MINORIDAI 5-CHOME,, MATSUDO-SHI, CHIBA, 270-2295, JAPAN
Covered Property
(1)
Forming Die Assembly for Microcomponents
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 9, 2023
From: HITACHI POWDERED METALS CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 062930/0328 →
Merger
Mar 10, 2023
From: HITACHI POWDERED METALS CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 063052/0251 →
Change of Name
Mar 10, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063052/0885 →
Change of Name
Mar 13, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063069/0417 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →