Patent Assignment
Reel/Frame 027161/0401
Assignment of Assignor's Interest
Recorded: 2011-11-02
Pages: 6
Assignors
LIN, CHIH-WEI
Executed: 2011-08-19
CHENG, MING-DA
Executed: 2011-08-19
LU, WEN-HSIUNG
Executed: 2011-08-19
LIN, HSIU-JEN
Executed: 2011-08-19
JANG, BOR-PING
Executed: 2011-08-19
LIU, CHUNG-SHI
Executed: 2011-08-19
LII, MIRNG-JI
Executed: 2011-08-26
YU, CHEN-HUA
Executed: 2011-08-26
CHEN, MENG-TSE
Executed: 2011-08-19
LIN, CHUN-CHENG
Executed: 2011-08-19
TSAI, YU-PENG
Executed: 2011-08-19
HUANG, KUEI-WEI
Executed: 2011-08-19
LIN, WEI-HUNG
Executed: 2011-08-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Methods and Structures for Semiconductor Devices