IP Library Assignment 027199/0275
Patent Assignment
Reel/Frame 027199/0275

Assignment of Assignor's Interest

Recorded: 2011-11-09 Pages: 5
Assignors
KATAGIRI, MITSUAKI
Executed: 2011-10-25
IWAKURA, KEN
Executed: 2011-10-25
UEMATSU, YUTAKA
Executed: 2011-10-25
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Semiconductor Package with Bonding Wires of Reduced Loop Inductance
Patent: 8,633,596 →
Application: 13/291,740 →
Publication: US 2012/0119387
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032901/0196 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046863/0001 →