Assignment of Assignor's Interest

Recorded: 2011-11-15 Pages: 2

Assignor

ITOU, HIROYUKI

Executed: 2011-10-28

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Apparatus and Method for Packaging Chip Components

Application: 13/297,034 →

Publication: US 2012/0117925

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.