Patent Assignment
Reel/Frame 027251/0111
Assignment of Assignor's Interest
Recorded: 2011-11-18
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Method of Making Stackable Semiconductor Assembly with Bump/Base/Flange Heat Spreader and Build-Up Circuitry