Assignment of Assignor's Interest

Recorded: 2011-11-18 Pages: 2

Assignor

IDE, TOSHIYUKI

Executed: 2011-11-16

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

550-1, HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

System and Method for Processing Substrate

Application: 13/299,668 →

Publication: US 2012/0135610

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.