Patent Assignment
Reel/Frame 027339/0130
Assignment of Assignor's Interest
Recorded: 2011-12-05
Pages: 2
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU,, TOKYO 103-8272, JAPAN
Covered Property
(1)
Wiring Board, Electronic Component Embedded Substrate, Method of Manufacturing Wiring Board, and Method of Manufacturing Electronic Component Embedded Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.