Patent Assignment
Reel/Frame 027364/0473
Assignment of Assignor's Interest
Recorded: 2011-12-12
Pages: 3
Assignors
YEO, DONG-HYUN
Executed: 2011-12-07
KIM, YONG-BUM
Executed: 2011-12-07
JEON, BYUNG-KIL
Executed: 2011-12-07
JUN, BONG-JU
Executed: 2011-12-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Test Pad Connected to an Exposed Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.