Assignment of Assignor's Interest

Recorded: 2011-11-22 Pages: 4

Assignors

AHN, DONG-GI

Executed: 2011-11-22

SEO, SEOUNG-JIN

Executed: 2011-11-22

KIM, BYOUNG-DONG

Executed: 2011-11-22

HONG, YONG-TAEK

Executed: 2011-11-22

Assignees

SAMSUNG SDI CO., LTD.

428-5, GONGSE-DONG, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Furnace and Method of Forming Thin Film Using the Same

Application: 13/271,777 →

Publication: US 2012/0220067

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.