Patent Assignment
Reel/Frame 027414/0169
Assignment of Assignor's Interest
Recorded: 2011-12-20
Received: 2011-12-20
Pages: 4
Assignors
BAE, HYUN-CHEOL
Executed: 2011-07-12
CHOI, KWANG-SEONG
Executed: 2011-07-12
EOM, YONG SUNG
Executed: 2011-07-12
MOON, JONG TAE
Executed: 2011-07-12
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
161, GAJEONG-DONG, YUSEONG-GU, DAEJEON, KRX, 305-700, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Filling a Through Silicon via (Tsv) and Substrate Including Tsv Plug Formed Using the Composition
Application:
13/330,719 →