Patent Assignment
Reel/Frame 027437/0190
Assignment of Assignor's Interest
Recorded: 2011-12-22
Pages: 3
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Substrate Processing Device and Method
Application:
13/332,609 →
Publication:
US 2012/0162618
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.