Assignment of Assignor's Interest

Recorded: 2011-12-28 Pages: 2

Assignor

SHINDO, YOSHIHIKO

Executed: 2011-10-11

Assignee

TYCO ELECTRONICS JAPAN G.K.

3-5-8, HISAMOTO, TAKATSU-KU, KAWASAKI-SHI, KANAGAWA-KEN, 213-8535, JAPAN

Covered Property (1)

Circuit Board Assembly, Board Device, and Method for Assembling Circuit Board Assembly

Patent: 8,616,901 →

Application: 13/338,105 →

Publication: US 2012/0164851

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.