IP Library › Assignment 027519/0696
Patent Assignment
Reel/Frame 027519/0696

Partial Release of Grant of Security Interest - Patents

Recorded: 2012-01-11 Pages: 4
Assignor
DYMAS FUNDING COMPANY, LLC
Executed: 2011-12-30
Assignee
GROUP DEKKO, INC.
2505 DEKKO DRIVE, GARRETT, INDIANA, 46738
Covered Property (1)
Sealed Iec Electrical Connector Assembly
Patent: 6,796,824 →
Application: 10/273,466 →
Publication: US 2004/0077203
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2011
From: GROUP DEKKO, INC.
To: ARCHTECH ELECTRONICS CORP.
Reel/Frame 025878/0199 →
Patent Security Agreement Oct 17, 2011
From: GROUP DEKKO, INC.
To: DYMAS FUNDING COMPANY, LLC
Reel/Frame 027074/0707 →