Patent Assignment
Reel/Frame 027521/0757
Corrective Assignment to Correct the Remove "Beate Beuermann" Listed Under Conveying Party. He Is Not One of the Inventors. Previously Recorded on Reel 024487 Frame 0695. Assignor(S) Hereby Confirms the Patent (12/729,682) Previous Assignment..
Recorded: 2012-01-12
Pages: 10
Assignors
STEINMANN, PHILIPP
Executed: 2010-03-23
SCHIEKOFER, MANFRED
Executed: 2010-03-23
KRAUS, MICHAEL
Executed: 2010-03-23
SCHARNAGL, THOMAS
Executed: 2010-03-23
SCHWARTZ, WOLFGANG
Executed: 2010-03-23
Assignee
TEXAS INSTRUMENTS DEUTSCHLAND GMBH
HAGGERTYSTRASSE 1, FREISING, 85356, GERMANY
Covered Property
(1)
Method of Forming an Electrical Contact Between a Support Wafer and the Surface of a Top Silicon Layer of a Silicon-on-Insulator Wafer and an Electrical Device Including Such an Electrical Contact
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 2010
From: STEINMANN, PHILIPP; SCHIEKOFER, MANFRED; KRAUS, MICHAEL; SCHARNAGL, THOMAS
To: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
Reel/Frame 024487/0695 →
Assignment of Assignor's Interest
Feb 16, 2021
From: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 055314/0255 →