Patent Assignment
Reel/Frame 027547/0848
Assignment of Assignor's Interest
Recorded: 2012-01-13
Pages: 3
Assignor
KONDO, MANABU
Executed: 2011-12-13
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU, 2-CHOME,, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Connecting Substrate and Method for Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.