Assignment of Assignor's Interest

Recorded: 2012-01-18 Pages: 3

Assignor

AOKI, DAIGO

Executed: 2012-01-12

Assignee

ALPS ELECTRIC CO., LTD.

1-7 YUKIGAYA-OTSUKAMACHI, OTA-KU, TOKYO, JAPAN

Covered Property (1)

Silicon Structure Having Bonding Pad

Patent: 8,546,948 →

Application: 13/353,261 →

Publication: US 2012/0112369

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.