Patent Assignment
Reel/Frame 027578/0618
Assignment of Assignor's Interest
Recorded: 2012-01-23
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same