Assignment of Assignor's Interest

Recorded: 2012-02-01 Pages: 2

Assignor

NUMAGUCHI, HIROYUKI

Executed: 2011-12-27

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Wiring Structure of Semiconductor Device and Method of Manufacturing the Wiring Structure

Application: 13/363,407 →

Publication: US 2012/0193813

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.