Patent Assignment
Reel/Frame 027685/0294
Assignment of Assignor's Interest
Recorded: 2012-02-10
Pages: 3
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
13-16 MITA 3-CHOME, MINATO-KU, TOKYO, 1080073, JAPAN
Covered Property
(1)
Ultrasonic Bonding Tool, Method for Manufacturing Ultrasonic Bonding Tool, Ultrasonic Bonding Method, and Ultrasonic Bonding Apparatus
Application:
13/379,669 →
Publication:
US 2012/0125520