Patent Assignment
Reel/Frame 027698/0096
Assignment of Assignor's Interest
Recorded: 2012-02-14
Pages: 3
Assignors
NISHIOKA, HIROYUKI
Executed: 2012-02-10
TOMINAGA, RYOJIRO
Executed: 2012-02-10
IMAI, TATSUYA
Executed: 2012-02-10
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board