Assignment of Assignor's Interest

Recorded: 2012-02-28 Pages: 2

Assignor

KAI, TAKATSUGU

Executed: 2012-02-17

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Clamp Circuit, Semiconductor Device, Signal Processing System, and Signal Clamping Method

Patent: 8,653,876 →

Application: 13/406,551 →

Publication: US 2012/0249208

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.