IP Library › Assignment 027854/0363
Patent Assignment
Reel/Frame 027854/0363

Assignment of Assignor's Interest

Recorded: 2012-03-13 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Light-Emitting Diode (Led) Package Systems
Patent: 8,390,009 →
Application: 12/706,040 →
Publication: US 2011/0198638
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 7, 2010
From: WANG, CHUNG YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. LTD.
Reel/Frame 024199/0083 →
Change of Name Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0198 →
Merger Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0212 →