Patent Assignment
Reel/Frame 027887/0092
Assignment of Assignor's Interest
Recorded: 2012-03-19
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2012-03-07
SHIH, DA-YUAN
Executed: 2012-03-07
TUNG, CHIH-HANG
Executed: 2012-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Joint Structure for Substrates and Methods of Forming