Patent Assignment
Reel/Frame 027914/0852
Assignment of Assignor's Interest
Recorded: 2012-03-23
Pages: 3
Assignor
LAVOIE, ADRIEN R.
Executed: 2010-09-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Methods and Architectures for Bottomless Interconnect Vias