Assignment of Assignor's Interest

Recorded: 2012-03-26 Pages: 2

Assignor

YOKAWA, AKIRA

Executed: 2012-03-15

Assignee

FUNAI ELECTRIC CO., LTD.

7-7-1 NAKAGAITO, DAITO-SHI, OSAKA, 574-0013, JAPAN

Covered Property (1)

Device Substrate Attachment Structure

Patent: 8,708,293 →

Application: 13/429,708 →

Publication: US 2012/0256066

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.