Assignment of Assignor's Interest

Recorded: 2012-03-27 Pages: 7

Assignors

MEYER, THORSTEN

Executed: 2012-03-27

WAIDHAS, BERND

Executed: 2012-03-27

ORT, THOMAS

Executed: 2012-03-27

Assignee

INTEL MOBILE COMMUNICATIONS GMBH

AM CAMPEON 10 - 12, NEUBIBERG, 85579, GERMANY

Covered Property (1)

Rotated Semiconductor Device Fan-Out Wafer Level Packages and Methods of Manufacturing Rotated Semiconductor Device Fan-Out Wafer Level Packages

Application: 13/430,765 →

Publication: US 2013/0256883

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.