Patent Assignment
Reel/Frame 027932/0633
Assignment of Assignor's Interest
Recorded: 2012-03-27
Received: 2012-03-27
Pages: 4
Assignor
MEYER, THORSTEN
Executed: 2012-03-27
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, DEX, 85579, GERMANY
Covered Property
(1)
Grid Fan-Out Wafer Level Package and Methods of Manufacturing a Grid Fan-Out Wafer Level Package
Application:
13/430,809 →