Patent Assignment
Reel/Frame 027989/0814
Assignment of Assignor's Interest
Recorded: 2012-04-04
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Level Reflector for Led Packaging
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 2010
From: KU, HAO-WEI; WANG, CHUNG YU; TANG, YU-SHENG; CHEN, HSIN-HUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025334/0549 →
Change of Name
Nov 24, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037158/0101 →
Merger
Nov 24, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037158/0154 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →