Assignment of Assignor's Interest

Recorded: 2012-05-10 Pages: 2

Assignors

HUANG, CHIH-FENG

Executed: 2007-08-10

CHIANG, CHIU-CHIH

Executed: 2007-08-10

WU, YOU-KUO

Executed: 2007-08-10

DOONG, LIH-MING

Executed: 2007-08-10

Assignee

SYSTEM GENERAL CORPORATION

8F, NO. 205-3, SEC. 3, BEISHIN ROAD, SHIN-DIAN CITY, TAIWAN, TAIWAN

Covered Property (1)

Multi-Chip Module Package

Application: 13/468,862 →

Publication: US 2012/0217657

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.